ID Number: G00170991



Semiconductor Packaging, Assembly and Test Facilities, Worldwide, 3Q09
4 September 2009
 
David Christensen   Masatsune Yamaji   Jim Walker   Barbara Van   Maria Valenzuela  

Since 2007, the Asia/Pacific region has increased its percentage of worldwide capacity, measured by manufacturing square footage, from 71% to 80%. Among the 18 planned facilities, 15 (83%) will be located in the Asia/Pacific region.




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Pages: 133






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Table of Contents


1 SPA Facilities

2 Subcontractor Facilities (SATS)

3 IDM Facilities

4 SPA Facilities of Companies Headquartered in Americas

5 SPA Facilities of Companies Headquartered in Asia/Pacific

6 SPA Facilities of Companies Headquartered in EMEA

7 SPA Facilities of Companies Headquartered in Japan

8 Activity Notes (Changes in Database Since Previous Update)

9 Figures

10 Glossary of Terms


List of Tables

1-1 Worldwide SPA Facilities, 3Q09

2-1 Worldwide SPA Subcontractor Facilities (SATS), 3Q09

3-1 Worldwide SPA IDM Facilities, 3Q09

4-1 SPA Facilities of Companies Headquartered in Americas, 3Q09

5-1 SPA Facilities of Companies Headquartered in Asia/Pacific, 3Q09

6-1 SPA Facilities of Companies Headquartered in EMEA, 3Q09

7-1 SPA Facilities of Companies Headquartered in Japan, 3Q09

8-1 Activity Notes (Changes in Database Since Previous Update)

10-1 Report Glossary


List of Figures

9-1 Planned Facilities, Number and Location

9-2 Percentage of Worldwide Semiconductor Packaging, Assembly and Test Factory Space by Country/Region

9-3 Percentage of Worldwide Semiconductor Packaging, Assembly and Test Facilities by Country/Region




Browse Topics:
 
Semiconductor Packaging and Assembly Facilities
Semiconductor Assembly and Test Services




This document is published in the following Dataquest Market Insights:
 
Semiconductor and Electronic Manufacturing Worldwide




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Resource Id: 1166712