ID Number: G00167545




Dataquest Insight: Through-Silicon Vias Offer Semiconductor Manufacturers Faster and Lower-Cost Integration
29 April 2009
 
Jim Walker   Dean Freeman   Mark Stromberg  

Through-silicon via technology will create a new multibillion dollar market and provide significant opportunities for equipment, materials, service and design suppliers.







Price: US$1,295.00

Pages: 7








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Table of Contents



    
Analysis

    
Introduction
    
3-D Packaging Technologies
    
Manufacturing Solutions for Integration
    
Benefits of TSVs
    
Drawbacks of TSVs
    
TSVs in Semiconductor Applications

    
Background and Context

    
Through-Silicon Vias

    
The Impact

    
Manufacturing Opportunities in TSVs

    
Conclusion

    
Recommended Reading


List of Tables



Table 1.  
TSV Adoption by Semiconductor Application
 

List of Figures



Figure 1. 
3-D Manufacturing Solutions
 



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This document is published in the following Dataquest Market Insights:
 
Semiconductor Industry Worldwide
Semiconductor and Electronic Manufacturing Worldwide





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Resource Id: 957212