ID Number: G00168107



Market Share: Semiconductor Back-End Equipment, Worldwide, 2008
11 May 2009
 
Mark Stromberg   Klaus Rinnen   Masatsune Yamaji  

In 2008, the semiconductor back-end equipment market declined just over 27%. This follows a decline of about 7% in 2007.




Price: US$6,995.00

Pages: 38






Browse Topics


Other Options







Contact Gartner





Purchasing this document is fast, easy and secure, but you must be registered with gartner.com so we can track your order. Please select your status from these three choices:
Registration is required to purchase this document.
Or, you can register for gartner.com only.
 You or your organization may already own this document. Register now to find out. Your Gartner Membership Administrator can supply the needed License Key(s).
You will not lose your document during registration.
Sign in here:
Username:

Password:
Forgot your username
or password?







For more information about purchasing this or other documents, contact Gartner at one of the telephone numbers below:
North America:    +1 203-316-3010 7:30 am - 8:00 pm Stamford, CT
Europe:    +44 1784 267770 9:00 am - 5:00 pm London
Asia/Pacific:    +65 6879 2785 9:00 am - 6:00 pm Singapore
Japan:    +81 3 3481 3552 9:00 am - 5:30 pm Tokyo

Table of Contents


This report provides market size and market share for the semiconductor back-end equipment market. The report generator allows the creation and customization of tables that provide 10-year historical data and regional market size. The following regions are covered in this report: Worldwide; the Americas; Japan; South Korea; China; Taiwan; Other Asia/Pacific; and Europe, the Middle East and Africa.

Deposition

Total Back-End Equipment

Total Packaging and Assembly Equipment

Wafer-Level Packaging Equipment

Advanced Packaging Lithography

Contact Probers

Wafer-Level Packaging Inspection

Wafer-Level Packaging Process Tools

Wet Clean for Wafer-Level Packaging

Dry Strip for Wafer-Level Packaging

Sputtering for Bump Processing

ECD for Bump Processing

Dry Etch for Through-Silicon Vias

Sputtering for Through-Silicon Vias

ECD for Through-Silicon Vias

Die-Level Packaging Equipment

Interconnect Bonding

Wire Bonders

Flip-Chip Bonders

TAB Bonders

Stud Bump Bonders

Die Bonders

Test Handlers

Wafer-Dicing Saws

Package-Level Vision Inspection

Molding/Encapsulation

Package Singulation

Solder Ball Attach

Laser Markers

Other Packaging Equipment

Total Test Equipment

Total SoC Test Equipment

Total Memory IC Test Equipment

Total RF IC Test Equipment

Analog/Linear IC Test Equipment

Other Test Equipment




Browse Topics:
 
Semiconductor Capital Spending
Semiconductor Packaging and Assembly Equipment
Automated Test Equipment




This document is published in the following Dataquest Market Insights:
 
Semiconductor and Electronic Manufacturing Worldwide




© 2009 Gartner, Inc. and/or its Affiliates. All Rights Reserved. Reproduction and distribution of this publication in any form without prior written permission is forbidden. The information contained herein has been obtained from sources believed to be reliable. Gartner disclaims all warranties as to the accuracy, completeness or adequacy of such information. Although Gartner's research may discuss legal issues related to the information technology business, Gartner does not provide legal advice or services and its research should not be construed or used as such. Gartner shall have no liability for errors, omissions or inadequacies in the information contained herein or for interpretations thereof. The opinions expressed herein are subject to change without notice.




Resource Id: 974314