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Forecast: Wafer Fab Capacity Picture for Top Capital Spenders, Worldwide, 4Q12 Update
13 December 2012
 
David Christensen   Samuel Tuan Wang   Bob Johnson   Barbara Van  

Since the 3Q12 update, Toshiba increased its 300-millimeter capacity in 2012, while the rest of the top spenders have reduced capacity or left it unchanged. Among the top spenders, the 300 mm capacity forecast in 2013 has been reduced as companies wait for demand to return.







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Table of Contents

1 Top Spender Capacity Picture, Worldwide, 2010-2013

2 Top Spender 300 mm Capacity Picture by Region, 2010-2013

3 Pivot Table: Top Capital Spender Capacity Picture, Worldwide, 2010-2013

4 2012 Joint-Venture Investments

5 Tips for Using Pivot Tables

6 Definition of Terms

7 Glossary of Terms

List of Tables

1-1 Top Spender Average Monthly Capacity (wspm) in 300 mm Equivalents and Annual MSI by Minimum Linewidth (nm), 2010-2013

2-1 Top Spender 300 mm Quarterly Capacity (MSI) by Region, 2010-2013

2-2 Top Spender 300 mm Capacity in Average Monthly wspm by Year by Region

3-1 Top Capital Spender Capacity Picture, Worldwide, 2010-2013

4-1 Estimated Joint-Venture Matrix of Capital Spending, 2012 (Millions of Dollars)

6-1 Report Glossary

List of Figures

2-1 Top Spender 300 mm Quarterly Capacity (MSI) by Region, 2010-2013

2-2 Top Spender 300 mm Capacity in Average Monthly wspm by Year by Region




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This document is published in the following Dataquest Market Insights:
 
Semiconductor and Electronic Manufacturing Worldwide





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Resource Id: 2276415