Teardown Report: Apple's New iPad and the Market Implications of Introducing the Retina Display


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This research provides a teardown analysis of the 16GB third generation/Long Term Evolution "New iPad" released by Apple in March 2012. Media tablet manufacturers, semiconductor suppliers and investors can learn the cost of the New iPad's components and how they impact current technology trends.

Table of Contents

  • Analysis
    • Product Overview
    • System Assembly
    • Stack Diagram of System Assembly
    • System Block Diagram
    • Circuit Boards, Main Integrated Circuits (ICs) and Connectors
      • System Printed Circuit Board (PCB)
      • 3G/LTE Cellular Module
      • Sensor PCB and Earphone/Microphone in FPC
      • LCD Panel
      • Battery Cells and Battery Gauge PCB
    • Material Cost Estimate and Analysis
  • Conclusion
  • Recommended Reading
© 2012 Gartner, Inc. and/or its Affiliates. All Rights Reserved. Reproduction and distribution of this publication in any form without prior written permission is forbidden. The information contained herein has been obtained from sources believed to be reliable. Gartner disclaims all warranties as to the accuracy, completeness or adequacy of such information. Although Gartners research may discuss legal issues related to the information technology business, Gartner does not provide legal advice or services and its research should not be construed or used as such. Gartner shall have no liability for errors, omissions or inadequacies in the information contained herein or for interpretations thereof. The opinions expressed herein are subject to change without notice.

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