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This research provides a teardown analysis of the 16GB third generation/Long Term Evolution "New iPad" released by Apple in March 2012. Media tablet manufacturers, semiconductor suppliers and investors can learn the cost of the New iPad's components and how they impact current technology trends.
Table of Contents
Stack Diagram of System Assembly
System Block Diagram
Circuit Boards, Main Integrated Circuits (ICs) and Connectors
- System Printed Circuit Board (PCB)
- 3G/LTE Cellular Module
- Sensor PCB and Earphone/Microphone in FPC
- LCD Panel
- Battery Cells and Battery Gauge PCB
Material Cost Estimate and Analysis
- Product Overview