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Baseband and application processors serving the fast growth of mobile devices will drive the demand for advanced semiconductor logic technologies. Future fab capacity expansion must be carefully planned as optimization of die sizes will be required to serve the cost-sensitive mobile market.
Table of Contents
Trends in the Market
Market: Large, Multicore Mobile Application Processors Entering Market
Manufacturing Considerations for Mobile Devices
- Die Size Matters
- Process Technology Optimization
- IP Optimization
- Yield Consideration
- Adequate Expansion of Fab Capacity
- Increased Revenue of Wafers to Manufacturers
- Manufacturing Considerations for Mobile Devices
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