Semiconductor Packaging, Assembly, and Test and Wafer Bump Facilities, Worldwide, 3Q15 Update


Archived Published: 15 September 2015 ID: G00272122

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Summary

For our 3Q15 update, we have recorded a total of 23 planned facilities located in Cambodia, China, Malaysia, Philippines, Singapore, South Korea and Taiwan.

Table of Contents

  • Overview
  • Gartner Recommended Reading
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