Gartner Research

Market Share Analysis: Semiconductor Assembly and Test Services, Worldwide, 2012

Published: 18 April 2013

ID: G00246133

Analyst(s): Jim Walker


Revenue for semiconductor assembly and test services increased 2.1% in 2012, reaching $24.5 billion. Leading-edge packaging technologies, including chip scale and flip chip, continued to expand in usage.

Table Of Contents

Market Share Data


  • Overall Market Segment Performance Analysis
  • Top Vendors Analyzed
    • ASE
    • Amkor
    • SPIL
    • STATS ChipPAC
    • PTI
    • UTAC
    • JCET
    • ChipMOS Technologies
    • J-Devices
    • Chipbond
  • Mergers and Acquisitions
    • ASE and Yang Ting Tech
    • PTI and Greatek
    • AIC and Globaltec Formation
    • Sigurd Microelectronics and Meicer Semiconductor
    • Fujitsu and J-Devices
    • China Resources Microelectronics and STATS ChipPAC

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