Gartner Research

Emerging Technology Analysis: Interposers Enable the Path to 3D Manufacturing

Published: 31 October 2013

ID: G00255613

Analyst(s): Jim Walker, Samuel Wang , Dean Freeman


The semiconductor industry needs fine-line interposers for 3D packaging and system-in-package to challenge system-on-chip integration for performance, lower-cost, shorter development cycle and faster time-to-market benefits.

Table Of Contents


  • Technology Description
  • Technology Adoption
    • Silicon
    • Glass
    • Organic
  • Technology Impact
    • Actions Needed
  • References

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