Gartner Research

Competitive Landscape: Metalization Equipment for Advanced Packaging

Published: 02 December 2013

ID: G00255731

Analyst(s): Mark Stromberg

Summary

Consolidation in the advanced packaging metalization market will be the major competitive driver in the near future.

Table Of Contents

Analysis

  • Competitive Situation and Trends
  • Market Players
  • The Future of Competition
    • Forces That Are Changing the Market Landscape
    • Which Will Be the Primary Markets?
    • Technical Requirements Will Shift the Market to Higher-Cost Systems
    • Alternative Process and Technical Threats to This Market
    • Thermal Dissipation Issues in the Nonmemory 3D Space
  • Competitive Profiles
    • Applied Materials
    • Canon Anelva
    • Ebara
    • Lam Research
    • Oerlikon Group
    • TEL
    • Ulvac
  • References and Methodology

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