Gartner Research

Competitive Landscape: Semiconductor Assembly and Test Services

Published: 11 December 2013

ID: G00255611

Analyst(s): Jim Walker

Summary

The outsourcing of packaging and test processes continues to drive SATS revenue growth as the semiconductor industry shifts its focus from manufacturing to product design and engineering. Leading-edge packaging technologies are driving revenue growth, specifically at the top SATS companies.

Table Of Contents

Analysis

  • Market Analysis
  • Competitive Situation and Trends
  • Market Players
  • The Future of Competition
    • Forces That Are Changing the SATS Landscape
    • Changes to the SATS Market
    • Consolidate via Merger or Acquisition
  • Competitive Profiles and Strategic Positioning
    • Advanced Semiconductor Engineering
    • Amkor Technology
    • Chipbond Technology
    • ChipMOS Technologies
    • J-Devices
    • Jiangsu Changjiang Electronics Technology
    • Powertech Technology
    • Siliconware Precision Industries
    • STATS ChipPAC
    • United Test and Assembly Center
  • References and Methodology

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