Gartner Research

Market Trends: Impact of DUV Multiple Patterning and EUV Lithography on the Economic Benefits of Moore's Law

Published: 06 March 2014

ID: G00259293

Analyst(s): Bob Johnson , Samuel Wang , Dean Freeman


Scaling of geometry beyond 20 nanometers requires semiconductor manufacturers to adopt deep ultraviolet MP or extreme ultraviolet lithography. While equipment costs with either alternative will soar, uncertainties about the viability of each one cast doubts on the economic benefits of Moore's Law.

Table Of Contents


Market Trend

  • Advancing to Sub-20-nm Nodes Using DUV Multiple Patterning While Waiting for EUV to Become Production Ready
  • Logic Wafer Manufacturing Trends
    • FinFET
    • Middle of the Line
    • DUV Multiple Patterning
  • Scenario Analysis of DUV and EUV
    • Assumptions
    • Results of Analysis
    • Lower Wafer Yield
    • Other Influencing Factors

Contrarian View

  • Different Opinions in Favor of DUV, EUV or 3D IC


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