Gartner Research

Report Highlight for Market Insight: Technology Issues Slow TSV Adoption and May Impact Moore's Law at 10 nm

Published: 03 April 2014

ID: G00263583

Analyst(s): Mark Stromberg

Summary

Several technical issues related to thermal dissipation, design, test and slow equipment throughput must be resolved before the IC industry can broadly adopt the through-silicon via process. In the mainstream consumer mobile phone and tablet PC markets, the technology's high cost is also a factor.

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Objective

Report Highlight

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