Gartner Research

Forecast Overview: PC and Ultramobile Production and Semiconductors, Worldwide, 2014

Published: 06 August 2014

ID: G00263336

Analyst(s): Ben Lee , Ganesh Ramamoorthy, Amy Teng , Sergis Mushell


This report provides the backbone support and the underlying foundational assumptions for the 2014 semiconductor forecast for PC and ultramobile. The value of this semiconductor market is expected to be sustained through to 2018. However, the mix of PC and ultramobile will substantially transform.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • Ultramobiles Emerged While Traditional PCs Declined in Units After 2011
  • ODMs Dominate the Traditional PCs and Are Extending to Ultramobile Production
  • Semiconductor Content in PCs and Ultramobiles Is Declining
  • Basic Tablet and Premium Clamshell Form Factors Gained Shares in Semiconductor Market

Foundational Assumptions

  • Traditional PC
    • End-Market Demand
    • Fundamental Integration
    • System Design
  • Ultramobile
    • End-Market Demand
    • Fundamental Integration
    • System Design

Market Model or Methodology

  • Definitions and Scope for PC and Ultramobile Production
  • Market Model
  • Forecast Components
    • Electronic Equipment Unit Production
    • Semiconductor Device Unit Content
    • Semiconductor Device ASPs
  • Influencing Factors
    • PC and Ultramobile Sales and Production
    • Enterprise Budgets and Spending
    • Consumer Spending
    • System Design and Functional Integration
    • Features and Functions
    • Supply Versus Demand and Cost Reduction
    • R&D Spending
    • Capital Spending
    • Data Processing and Mobile Communications Industry-Specific Regulation/Legislation
    • Business Performance, Strategies and Objectives
  • Connections
    • Enterprise Budgets and Spending — PC and Ultramobile Sales and Production
    • Consumer Spending — PC and Ultramobile Sales and Production
    • Features and Functions — System Design
    • Device and Package Design — Functional Integration
    • Technology Node — Functional Integration
    • Device and Package Design — Features and Functions
    • Technology Node — Cost Reduction
    • Capital Spending — Manufacturing Utilization

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