Gartner Research

Forecast Overview: Semiconductor Assembly and Test Services, Worldwide, 2014

Published: 15 August 2014

ID: G00263324

Analyst(s): Klaus Rinnen, Mark Stromberg, Jim Walker


To conserve capital and mitigate risk from package proliferation, integrated device manufacturers are outsourcing more of their packaging and test requirements and additionally transferring their manufacturing facilities to SATS companies.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • Packaging and Test Outsourcing Growth
  • Proliferation of Companies and Stratification of the SATS Marketplace
    • Broad-Based, Leading-Edge Packaging and Test Service Providers
    • Specialty/Niche Service Providers
    • Mature/Value Service Providers

Foundational Assumptions

  • Competition at Leading-Edge
  • Industry Consolidation
  • Increased Outsourcing From IDMs
  • Capital Spending Increases
  • SATS Pricing
  • Manufacturing Convergence and Integration

Market Model or Methodology

  • Forecast Components
    • Semiconductor Assembly and Test Services Revenue Forecast
    • Package Unit Demand
    • Package ASP
  • Influencing Factors
    • Macroeconomy
    • Electronic Equipment Production Forecast
    • Silicon Wafer Demand
    • Chip Unit Demand
    • SATS Capacity Utilization
    • SATS Capital Spending
    • Number of SATS Facilities
    • Technology Road Map
    • Type of Device
    • Package Type
  • Connections
    • Package Unit Demand > Package ASP > SATS Revenue Forecast
    • Technology Road Map > Type of Device > Package Type > Package ASP
    • Silicon Wafer Demand > Chip Unit Demand > Package Unit Demand
    • SATS Capacity Utilization > SATS Capital Spending > Number of SATS Facilities

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