Gartner Research

Market Insight: How Foundries Will Compete in the 3D World

Published: 10 September 2014

ID: G00269495

Analyst(s): Samuel Wang

Summary

The adoption of true 3D ICs will be driven by high-performance SoCs manufactured by FinFET technology, as well as the rise of the Internet of Things. Key foundries have defined various strategies in partnership with other suppliers to compete in the 3D IC business.

Table Of Contents

Analysis

  • The Advantages of 3D ICs
  • Operational Advantages of Foundries in 3D IC Manufacturing
  • Various Business Models of 3D ICs Between Foundries and SAT Companies
    • TSMC Chooses Foundry Turnkey Model
    • Globalfoundries Collaborates With SAT Companies
    • UMC Jointly Develops 3D IC Technology With STATS ChipPAC
    • Samsung Leverages Wafer Manufacturing Through Integrated Services
    • SMIC and JCET Form Partnership

Background and Context

  • Manufacturing Flow of 3D ICs
  • Why Hasn't 3D IC Technology Taken Off?
  • Device Scaling to 14 nm Makes 3D ICs Necessary
    • Larger Dies Deteriorate Overall Yields
    • RC Delay Must Be Reduced
  • Which 3D IC Chips Are Next?

The Impact

Conclusion

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