Gartner Research

IC Packaging Technology Trends and Forecast

Published: 08 May 2000

ID: G0087085

Analyst(s): Jim Walker


Packaging technology is constantly changing in direct response to the need for semiconductor chips to increase functionality at lower costs and smaller spaces. Device design needs have continued to fragment the driving forces. However, the emergence of SOC and SLI, along with the convergence of interconnect design inside and outside the chip, create a foggy road. In the topic, Dataquest examines the packaging issues to create a technology forecast.

Table Of Contents
  • Executive Summary: Direct Chip Attach Methods Show Significant Changes and Growth
    • High-Density Interconnections
    • Flip Chip Usage Increasing
    • Chip Scale Packaging Continues to Diversify
  • Emerging Packaging Trends
    • 3D and Multichip Packages
    • Multichip Packaging and System in a Package
    • Integrated Passives
    • Lead Solder Replacement
    • MEMS and Nanotechnology
  • A New Direction
    • Mass Customization of Packaging
    • Future Technology
    • Outsourcing Growth

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