Published: 08 May 2000
Analyst(s): Jim Walker
Packaging technology is constantly changing in direct response to the need for semiconductor chips to increase functionality at lower costs and smaller spaces. Device design needs have continued to fragment the driving forces. However, the emergence of SOC and SLI, along with the convergence of interconnect design inside and outside the chip, create a foggy road. In the topic, Dataquest examines the packaging issues to create a technology forecast.
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