Published: 08 May 2000
ID: G0087085
Analyst(s): Jim Walker
Packaging technology is constantly changing in direct response to the need for semiconductor chips to increase functionality at lower costs and smaller spaces. Device design needs have continued to fragment the driving forces. However, the emergence of SOC and SLI, along with the convergence of interconnect design inside and outside the chip, create a foggy road. In the topic, Dataquest examines the packaging issues to create a technology forecast.
©2019 Gartner, Inc. and/or its affiliates.
All rights reserved.
Gartner is a registered trademark of Gartner, Inc. and its affiliates.
This publication may not be reproduced or distributed in any form without Gartner’s prior written permission.
It consists of the opinions of Gartner’s research organization, which should not be construed as statements of fact.
While the information contained in this publication has been obtained from sources believed to be reliable, Gartner disclaims all warranties as to the accuracy, completeness or adequacy of such information.
Although Gartner research may address legal and financial issues, Gartner does not provide legal or investment advice and its research should not be construed or used as such.
Your access and use of this publication are governed by Gartner’s Usage Policy.
Gartner prides itself on its reputation for independence and objectivity.
Its research is produced independently by its research organization without input or influence from any third party.
For further information, see Guiding Principles on Independence and Objectivity.