Gartner Research

Forecast Overview: PC and Ultramobile Production and Semiconductors, Worldwide, 2015

Published: 21 August 2015

ID: G00271889

Analyst(s): Ben Lee , Amy Teng , Roger Sheng , Nathan Nuttall


The traditional PC and ultramobile semiconductor market accounted for 23.8% of the global semiconductor market, and it is expected to decline to 20% by 2019. The share mix of traditional PCs and ultramobiles will change substantially.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • Premium Ultramobiles Gain in Market Share, While Basic and Utility Ultramobiles Have Seen Their First Decline in 1H15
  • ODMs Continue to Dominate PC and Ultramobile Production
  • Semiconductor Content Is Declining Slower Than Average Selling Prices for PCs/Ultramobiles
  • Basic Tablet and Premium Clamshell Gained Shares in Semiconductor Market

Foundational Assumptions

  • Traditional PC
    • End-Market Demand
    • Functional Integration
    • System Design
  • Ultramobile
    • End-Market Demand
    • Functional Integration
    • System Design

Market Model or Methodology

  • Definitions and Scope for PC and Ultramobile Production
  • Market Model
  • Forecast Components
    • PC and Ultramobile Unit Production
    • Semiconductor Device Unit Content
    • Semiconductor Device ASPs
  • Influencing Factors
    • PC and Ultramobile Sales and Production
    • Enterprise Budgets and Spending
    • Consumer Spending
    • System Design and Functional Integration
    • Features and Functions
    • Supply Versus Demand and Cost Reduction
    • R&D Spending
    • Capital Spending
    • Data Processing and Mobile Communications Industry-Specific Regulation/Legislation
    • Business Performance, Strategies and Objectives
  • Connections
    • Enterprise Budgets and Spending — PC and Ultramobile Sales and Production
    • Consumer Spending — PC and Ultramobile Sales and Production
    • Features and Functions — System Design
    • Device and Package Design — Functional Integration
    • Technology Node — Functional Integration
    • Device and Package Design — Features and Functions
    • Technology Node — Cost Reduction
    • Capital Spending — Manufacturing Utilization

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