Gartner Research

3D NAND Flash Will Change the Semiconductor Manufacturing Equipment Landscape

Published: 21 October 2015

ID: G00291637

Analyst(s): Samuel Wang , Bob Johnson , Joseph Unsworth , Takashi Ogawa


3D NAND is a disruptive technology that enables the reduction of NAND bit cost by building memory cells vertically. The cost structure for 3D NAND manufacturing will benefit semiconductor equipment manufacturers in producing etch and deposition equipment versus lithography tools.

Table Of Contents
  • Impacts


Impacts and Recommendations

  • Deposition and etching systems, which will account for almost 60% of the equipment investment for first-generation 3D NAND, compared with 34% for 1X nm planar NAND, will bring new business to semiconductor equipment manufacturers
  • Capital spending for NAND flash production will account for about three-fourths of total capital spending growth from 2015 through 2019, compelling semiconductor equipment manufacturers to focus on NAND technology
  • 3D NAND manufacturing will enable greater proliferation of SSDs into PCs and data centers, which will represent 66% of NAND consumption in 2019, and provide semiconductor equipment manufacturers with a good revenue opportunity
  • Bit cost reduction in future 3D NAND generations will focus on smaller cell sizes, more layers and more bits per cell, requiring greater collaboration between semiconductor equipment manufacturers and NAND device makers

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