Gartner Research

Forecast Overview: Wearable Electronics Production and Semiconductors, Worldwide, 2015

Published: 26 October 2015

ID: G00272204

Analyst(s): Angela McIntyre, Michele Reitz


The wearables semiconductor market will grow from $848 million in 2014 to $4.26 billion in 2019. Product marketing executives at semiconductor and equipment providers should evaluate this market, focusing on four categories of wearables, including smartwatches and fitness devices.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • Wearables Unit Production and Trends
    • Fitness Wearables Pave the Way, but the Smartwatch and HMD Categories Are Growing Faster
    • Explosive Growth in HMDs, Wearable Cameras and Smart Glasses on Small Base
    • Apple Watch Will Dominate the Smartwatch Category
    • Other Wearables Category Is Dominated by Bluetooth headsets
  • Wearables Semiconductor Revenue
    • Wearables Semiconductor Design Considerations
    • Wearables Semiconductor Revenue by Category
    • Wearables Semiconductor Content

Foundational Assumptions

  • Channel and End-Market Demand
  • Electronic Equipment Price Point
  • Features and Functions
  • Functional Integration
  • Technology Node
  • Device and Package Design
  • Regulations and Standards

Market Model or Methodology

  • Forecast Components
    • Wearables Equipment Unit Production
    • Wearables Semiconductor Device Unit Content
    • Wearables Semiconductor Device ASPs
  • Influencing Factors
    • Electronic Equipment Inventory
    • Channel Demand and End-Market Demand
    • Electronic Equipment Price Point
    • Enterprise and Consumer Spending
    • Macroeconomic, Geopolitical and Demographic Factors
    • System Design and Functional Integration
    • Features and Functions
    • Regulation and Standards
    • Device and Package Design
    • Technology Node
    • Capital Spending and Manufacturing Utilization
    • Semiconductor Industry Structure and R&D Spending
    • Pricing Dynamics
    • Cost Reduction, and Supply and Demand
    • Chip Inventory
  • Connections
    • Enterprise and Consumer Spending > Channel and End-Market Demand
    • Features and Functions > System Design
    • Device and Package Design > Functional Integration
    • Technology Node > Device and Package Design > Functional Integration
    • Device and Package Design > Features and Functions
    • Technology Node > Cost Reduction
    • Capital Spending > Manufacturing Utilization

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