Published: 26 March 2001
Analyst(s): Masao Kuniba
SiP, constructed by a packaging solution of MCP, is part of a process to approach SLI by SoC. From this starting point, Gartner Dataquest reviews the flexibility of packaging solutions with the SiP configuration, which fills the gap of the package and SLI. This Perspective analyzes the state of buildup substrates and flip-chip package technology, which are the basic technologies indispensable to SiP by MCP. This Perspective also looks at how the future packaging solution should be.
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