Published: 26 March 2001
Analyst(s): Masao Kuniba
SiP, constructed by a packaging solution of MCP, is part of a process to approach SLI by SoC. From this starting point, Gartner Dataquest reviews the flexibility of packaging solutions with the SiP configuration, which fills the gap of the package and SLI. This Perspective analyzes the state of buildup substrates and flip-chip package technology, which are the basic technologies indispensable to SiP by MCP. This Perspective also looks at how the future packaging solution should be.
©2020 Gartner, Inc. and/or its affiliates.
All rights reserved.
Gartner is a registered trademark of Gartner, Inc. and its affiliates.
This publication may not be reproduced or distributed in any form without Gartner’s prior written permission.
It consists of the opinions of Gartner’s research organization, which should not be construed as statements of fact.
While the information contained in this publication has been obtained from sources believed to be reliable, Gartner disclaims all warranties as to the accuracy, completeness or adequacy of such information.
Although Gartner research may address legal and financial issues, Gartner does not provide legal or investment advice and its research should not be construed or used as such.
Your access and use of this publication are governed by Gartner’s Usage Policy.
Gartner prides itself on its reputation for independence and objectivity.
Its research is produced independently by its research organization without input or influence from any third party.
For further information, see
Guiding Principles on Independence and Objectivity.