Gartner Research

Forecast Overview: PC and Ultramobile Production and Semiconductors, Worldwide, 2016

Published: 20 May 2016

ID: G00294877

Analyst(s): Roger Sheng , Ben Lee , Nathan Nuttall, Hiroyuki Shimizu, Amy Teng

Summary

The fully equipped traditional PC and ultramobile semiconductor market reached $70 billion or 21% of the global semiconductor market in 2015, compared with its peak of 25.4% in 2011. Gartner predicts it will decline to 17.6% by 2020.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • The Premium Ultramobile Was the Only Platform to Grow in 2015, While Basic and Utility Ultramobiles Experienced Their First Decline
  • Major ODMs Dominate Production, and Chinese ODMs Emerge
  • Semiconductor I/O Ratio Is Increasing as a Percentage of Semiconductor Content Versus Average Selling Prices for PCs/Ultramobiles
  • Premium Ultramobile Is the Only Winner in PCs and Ultramobile Platforms in Semiconductor Market in 2015

Foundational Assumptions

  • Traditional PC
    • End-Market Demand
    • Functional Integration
    • System Design
    • Supply and Demand
  • Ultramobile
    • End-Market Demand
    • Functional Integration
    • System Design

Market Model or Methodology

  • Definitions and Scope for PC and Ultramobile Production
  • Market Model
  • Forecast Components
    • PC and Ultramobile Unit Production
    • Semiconductor Device Unit Content
    • Semiconductor Device ASPs
  • Influencing Factors
    • PC and Ultramobile Sales and Production
    • Enterprise Budgets and Spending
    • Consumer Spending
    • System Design and Functional Integration
    • Features and Functions
    • Supply Versus Demand and Cost Reduction
    • R&D Spending
    • Capital Spending
    • Data Processing and Mobile Communications Industry-Specific Regulation/Legislation
    • Business Performance, Strategies and Objectives
  • Connections
    • Enterprise Budgets and Spending — PC and Ultramobile Sales and Production
    • Consumer Spending — PC and Ultramobile Sales and Production
    • Features and Functions — System Design
    • Device and Package Design — Functional Integration
    • Technology Node — Functional Integration
    • Device and Package Design — Features and Functions
    • Technology Node — Cost Reduction
    • Capital Spending — Manufacturing Utilization

Gartner Recommended Reading

©2020 Gartner, Inc. and/or its affiliates. All rights reserved. Gartner is a registered trademark of Gartner, Inc. and its affiliates. This publication may not be reproduced or distributed in any form without Gartner’s prior written permission. It consists of the opinions of Gartner’s research organization, which should not be construed as statements of fact. While the information contained in this publication has been obtained from sources believed to be reliable, Gartner disclaims all warranties as to the accuracy, completeness or adequacy of such information. Although Gartner research may address legal and financial issues, Gartner does not provide legal or investment advice and its research should not be construed or used as such. Your access and use of this publication are governed by Gartner’s Usage Policy. Gartner prides itself on its reputation for independence and objectivity. Its research is produced independently by its research organization without input or influence from any third party. For further information, see Guiding Principles on Independence and Objectivity.

Already have a Gartner Account?

Purchase this Document

To purchase this document, you will need to register or sign in above

Become a client

Learn how to access this content as a Gartner client.