Gartner Research

Forecast Overview: PC and Ultramobile Production and Semiconductors, Worldwide, 2016

Published: 20 May 2016

ID: G00294877

Analyst(s): Roger Sheng , Ben Lee , Nathan Nuttall , Hiroyuki Shimizu, Amy Teng


The fully equipped traditional PC and ultramobile semiconductor market reached $70 billion or 21% of the global semiconductor market in 2015, compared with its peak of 25.4% in 2011. Gartner predicts it will decline to 17.6% by 2020.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • The Premium Ultramobile Was the Only Platform to Grow in 2015, While Basic and Utility Ultramobiles Experienced Their First Decline
  • Major ODMs Dominate Production, and Chinese ODMs Emerge
  • Semiconductor I/O Ratio Is Increasing as a Percentage of Semiconductor Content Versus Average Selling Prices for PCs/Ultramobiles
  • Premium Ultramobile Is the Only Winner in PCs and Ultramobile Platforms in Semiconductor Market in 2015

Foundational Assumptions

  • Traditional PC
    • End-Market Demand
    • Functional Integration
    • System Design
    • Supply and Demand
  • Ultramobile
    • End-Market Demand
    • Functional Integration
    • System Design

Market Model or Methodology

  • Definitions and Scope for PC and Ultramobile Production
  • Market Model
  • Forecast Components
    • PC and Ultramobile Unit Production
    • Semiconductor Device Unit Content
    • Semiconductor Device ASPs
  • Influencing Factors
    • PC and Ultramobile Sales and Production
    • Enterprise Budgets and Spending
    • Consumer Spending
    • System Design and Functional Integration
    • Features and Functions
    • Supply Versus Demand and Cost Reduction
    • R&D Spending
    • Capital Spending
    • Data Processing and Mobile Communications Industry-Specific Regulation/Legislation
    • Business Performance, Strategies and Objectives
  • Connections
    • Enterprise Budgets and Spending — PC and Ultramobile Sales and Production
    • Consumer Spending — PC and Ultramobile Sales and Production
    • Features and Functions — System Design
    • Device and Package Design — Functional Integration
    • Technology Node — Functional Integration
    • Device and Package Design — Features and Functions
    • Technology Node — Cost Reduction
    • Capital Spending — Manufacturing Utilization

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