Gartner Research

Forecast Overview: Semiconductor Assembly and Test Services, Worldwide, 2016

Published: 01 June 2016

ID: G00296475

Analyst(s): Jim Walker

Summary

The growth rate of outsourcing semiconductor packaging and test is slowing. Demand for faster time to market and lower-cost solutions are driving device designers to seek possible packaging alternatives to device and system integration.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • Outsourcing Growth of Packaging and Test
  • Proliferation of Companies and Stratification of the SATS Marketplace
    • Broad-Based, Leading-Edge Packaging and Test
    • Specialty/Niche
    • Mature Technology/Sunset

Foundational Assumptions

  • Industry Structure/Competition
  • Fabless and IDM Outsourcing Strategy
  • Capital Spending
  • Pricing Dynamics
  • System Design
  • Package Technology

Market Model or Methodology

  • Forecast Components
    • SATS Revenue Forecast
    • Package Unit Demand
    • Package ASP
    • Fabless IDM Market Share Change
  • Influencing Factors
    • Macroeconomic, Geopolitical and Demographic Factors
    • Electronic Equipment
    • System End-Market Demand
    • Semiconductor Forecast
    • Fabless/IDM Outsourcing Strategy
    • Packages per System
    • System Design
    • Chip and Package Design
    • Features and Functions
    • Package Technology
    • Capital Spending
    • Cost Reduction
    • Pricing Dynamics
    • Supply and Demand
    • Chip Inventory
    • Manufacturing Utilization
    • SATS Industry Structure/Competition

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