Gartner Research

Update: Gartner to Retire Its Semiconductor Packaging and Assembly Research Coverage

Published: 27 July 2016

ID: G00311060

Analyst(s): Klaus Rinnen, Jim Walker

Summary

In January 2017, Gartner will retire its semiconductor packaging and assembly research coverage, including its packaging and assembly site and semiconductor assembly and test services coverage. Read this document for further details.

Table Of Contents

Planned Update to Gartner Market Statistics Coverage

  • What We Are Changing
  • Why We Are Making the Change
  • Client Benefits of the Change

©2020 Gartner, Inc. and/or its affiliates. All rights reserved. Gartner is a registered trademark of Gartner, Inc. and its affiliates. This publication may not be reproduced or distributed in any form without Gartner’s prior written permission. It consists of the opinions of Gartner’s research organization, which should not be construed as statements of fact. While the information contained in this publication has been obtained from sources believed to be reliable, Gartner disclaims all warranties as to the accuracy, completeness or adequacy of such information. Although Gartner research may address legal and financial issues, Gartner does not provide legal or investment advice and its research should not be construed or used as such. Your access and use of this publication are governed by Gartner’s Usage Policy. Gartner prides itself on its reputation for independence and objectivity. Its research is produced independently by its research organization without input or influence from any third party. For further information, see Guiding Principles on Independence and Objectivity.

Already have a Gartner Account?

Become a client

Learn how to access this content as a Gartner client.