Gartner Research

Market Trends: FOWLP Will Require Changes in SATS Companies' Business Model

Published: 19 August 2016

ID: G00301813

Analyst(s): Jim Walker, Samuel Wang

Summary

Foundry and SATS CMOs must have strategies to address fan-out wafer-level packaging, as it will cause new outsourcing business models to emerge, resulting in adaptable, integrated manufacturing solutions for IoT and mobile applications.

Table Of Contents

Introduction

Market Trend

  • Market Structure Trend
    • The Market Structure Is Trending to More Waferlike Manufacturing
  • Supplier Trend
    • SATS, Foundries, Panel Makers Are Seeking Opportunities in FOWLP Business
  • Buyer Trend
    • Many New IoT and Mobile Applications Will Require Customized Packaging Solutions
  • Technology Trend
    • Migration to More WLP Processes and Embedding

Contrarian View

  • What If the Market Does Not Adopt FOWLP and System-in-Package?

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