Gartner Research

Forecast Overview: PC and Ultramobile Production and Semiconductors, Worldwide, 2017

Published: 12 May 2017

ID: G00295541

Analyst(s): Ben Lee , Roger Sheng , Alan Priestley , Hiroyuki Shimizu, Claire Wen


The semiconductor market for PCs and ultramobiles is not expected to grow through 2021. However, platforms and semiconductor devices will diversify. Technology strategic planners at semiconductor vendors can use this document to plan and enrich their offerings of semiconductor devices.

Table Of Contents
  • Overview
  • Companion Documents

Market Description

  • The Semiconductor Market for PCs and Ultramobiles Is No Longer a Driving Force and Is Losing Share of the Global Semiconductor Market
  • Premium Ultramobiles Were the Only Platform to Grow in Units While Utility Tablets Experienced Severe Decline in 2016
  • Processors, Application-Specific Standard Products (ASSPs) and Memory Shared Nearly 90% of Semiconductor Content in Fully Equipped PCs

Foundational Assumptions

  • Traditional PCs
    • End-Market Demand
    • Functional Integration
    • System Design
  • Ultramobile
    • End-Market Demand
    • Functional Integration
    • System Design

Market Model or Methodology

  • Definitions and Scope for PC and Ultramobile Production
  • Market Model
  • Forecast Components
    • PC and Ultramobile Unit Production
    • Semiconductor Device Unit Content
    • Semiconductor Device ASPs
  • Influencing Factors
    • PC and Ultramobile Sales and Production
    • Enterprise Budgets and Spending
    • Consumer Spending
    • System Design and Functional Integration
    • Features and Functions
    • Supply Versus Demand and Cost Reduction
    • R&D Spending
    • Capital Spending
    • Data Processing and Mobile Communications Industry-Specific Regulation/Legislation
    • Business Performance, Strategies and Objectives
  • Connections
    • Enterprise Budgets and Spending — PC and Ultramobile Sales and Production
    • Consumer Spending — PC and Ultramobile Sales and Production
    • Features and Functions — System Design
    • Device and Package Design — Functional Integration
    • Technology Node — Functional Integration
    • Device and Package Design — Features and Functions
    • Technology Node — Cost Reduction
    • Capital Spending — Manufacturing Utilization

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