Gartner Research

Market Insight: 2016 Semiconductor Front-End and Wafer-Level Packaging Equipment Markets

Published: 12 June 2017

ID: G00333977

Analyst(s): David Christensen, Barbara Van, Takashi Ogawa, Bob Johnson

Summary

Semiconductor wafer fab equipment addresses two major classifications of production: front-end manufacturing (fabs) and wafer-level packaging. Technology strategic planners need to understand how these markets interact with their product portfolios.

Table Of Contents

Analysis

Background and Context

The Impact

Conclusion

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