Gartner Research

Market Definitions and Methodology: Semiconductor Wafer Fab Equipment (Including Wafer-Level Packaging)

Published: 25 September 2017

ID: G00341930

Analyst(s): Takashi Ogawa, Maria Valenzuela, Barbara Van, David Christensen, Bob Johnson

Summary

This document contains the segment methodology and definitions used in semiconductor equipment forecasts and market share research.

Table Of Contents

What You Need to Know

Introduction

Notable Changes

Methodology

  • Market Share Methodology
  • Vendor Revenue Profile
  • Mergers and Acquisitions
  • Change of Vendor Name
  • Documentation and Citation

Metrics

High-Level Definitions and Segmentation

  • Semiconductor Equipment Market Segmentation
    • Wafer Fab Equipment (Including Wafer-Level Packaging)
    • Photoresist Processing (Track)
  • Product Definitions
    • Lithography
    • Photoresist Track
    • Doping Equipment
    • RTP and Oxidation/Diffusion
    • Deposition
    • Material Removal and Cleaning
    • Manufacturing Automation and Control
    • Process Control
    • Other Wafer-Level Manufacturing Equipment

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