Gartner Research

FEOL Process Technology: The Transition to Vertical

Published: 28 February 2003

ID: G00113316

Analyst(s): Dean Freeman


Front-end-of the-line process technology is changing significantly as the transistor moves from planar to vertical. All front-end equipment segments will be affected by the move to sub-45-nanometer nodes.

Table Of Contents
  • Executive Summary
  • Changes to the Transistor
  • Substrates
    • Silicon on Insulator
    • Strained Silicon
  • The Gate
    • Gate Dielectric
    • Gate Electrode
    • Source Drain Region
  • Capacitors
  • Transistor Architecture
    • FinFETS and Multiple Gates
  • Glossary of Terms

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