Gartner Research

Advanced Packaging Technology Will Enable Faster Time to Market for Digital-Twin Chips

Published: 02 April 2019

ID: G00383343

Analyst(s): Samuel Wang, Bob Johnson

Summary

Advanced semiconductor packaging can integrate chiplets of various functions from different sources together. Technology product managers at chip manufacturing companies must adopt it for faster time to market for chips targeted at digital-twin applications.

Table Of Contents

Analysis

  • No Longer Can the Traditional Single-Chip Solution Compete Effectively in the Semiconductor Marketplace
    • Active Silicon Packaging Technologies Enable the Bundling of Function-Specific Chips From Multiple Sources Together to Function as a Single Integrated System
    • A New Business Model of Semiconductor Manufacturing Is Now Possible With the Advanced Packaging Technology That Allows Silicon-Ready IP to Be Grouped Together as One SoC
    • Collaboration Among Competitors Becomes More Feasible as Silicon-Ready IP Is Significantly More Difficult to Copy Than Raw IP Data
    • Digital Twins Requiring Multiple Semiconductor Chips Get Benefit From the Advanced Packaging Technology

Conclusion

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