Published: 06 January 2023
Fan-out packaging is emerging as one of the cost-effective advanced packaging approaches for advanced node chips targeting emerging applications, such as data centers, HPC and automotive. Product leaders must assess all options based on cost-performance curve.
Traditional packaging types can hardly meet the higher pin count requirement, while most leading-edge advanced packaging technologies, such as 2.5D/3D and 3.5D, are not cost-effective options for mid- to low-end applications with high-performance requirements. Fan-out packaging is therefore a viable option.
Innovations in new materials, manufacturing techniques and developments in efficiency improvement are increasingly positioning fan-out packaging technology for mainstream adoption.
Beyond smartphones, a slew of new applications ranging from consumer, Internet of Things (IoT) and automotive to hyperscale data center, high-performance computing (HPC) and 5G applications are adopting fan-out packaging approaches to improve performance and reduce cost.
Product leaders
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