Gartner Research

1Q04 Semiconductor Manufacturing Forecast: Back-End Equipment

Published: 25 February 2004

ID: G00119741

Analyst(s): Laurie Balch, Masao Kuniba, Jim Walker, Mark Stromberg


The back-end equipment industry will grow more than 40 percent in 2004. The automated test equipment segment will have its first solid growth after a three-year downcycle.

Table Of Contents
  • Executive Summary
    • Outlook: Back-End Equipment Forecast, 2004‑2008
    • 2003: Growth Returns to the Equipment Market
  • Back-End Equipment Forecast
    • Assumptions
  • Equipment Market Segments
    • Advanced-Packaging Lithography
    • Contact Probers
    • Laser-Marking Equipment
    • Solder Ball Attach
    • Package Singulation
    • Molding and Encapsulation
    • TAB Equipment
    • Wire Bonders
    • Flip-Chip Bonders
    • Die Bonders
    • Wafer Saw Equipment
    • Test Handlers
    • Vision Inspection
    • Test Equipment
  • Gartner Dataquest Perspective
    • Strong Growth Is Back
  • Glossary of Terms

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