Published: 01 June 2023
Key innovations in semiconductor technologies relating to memory, connectivity, storage and processor architecture will play a critical role in the development of next-generation data center infrastructure. Product leaders must track these trends and integrate them into their product plans.
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The use of Arm and RISC-V-based microprocessors must be evaluated when planning new data center infrastructure.
Efficiently supporting the increasing data volumes and diversity of new workloads, such as AI, will require the use of a range of different workload and function accelerators and high-performance networking.
Memory capacity and access bandwidth are rapidly becoming a performance limiter for many modern workloads.
Optical interconnects are required both between servers and between devices in a server to reduce energy consumption and increase data transfer speeds.
The use of multidie, chiplet-based designs will enable chip designs to scale to meet the demands of future-generation workloads.
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