Gartner Research

Semiconductor Packaging, Assembly and Test Facilities: Worldwide, 2Q06 Update (Executive Summary)

Published: 31 March 2006

ID: G00138804

Analyst(s): Jim Walker, Masatsune Yamaji , Tom Yu, David Christensen


Semiconductor packaging, assembly and test companies increasingly prefer China. Of the 18 facilities planned to begin production through the end of 2007, 17 will be in Asia/Pacific, including 11 in China.

Table Of Contents
  • New Announcements of Planned Facilities
  • Total Planned Facilities Now in the Pipeline
  • Two New Facilities in Production
  • Worldwide Capacity Is Shifting to China

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