Gartner Research

Semiconductor Packaging, Assembly and Test Facilities: Worldwide, 2Q06 Update (Executive Summary)

Published: 31 March 2006

ID: G00138804

Analyst(s): Jim Walker , Masatsune Yamaji , Tom Yu , David Christensen

Summary

Semiconductor packaging, assembly and test companies increasingly prefer China. Of the 18 facilities planned to begin production through the end of 2007, 17 will be in Asia/Pacific, including 11 in China.

Table Of Contents
  • New Announcements of Planned Facilities
  • Total Planned Facilities Now in the Pipeline
  • Two New Facilities in Production
  • Worldwide Capacity Is Shifting to China

©2019 Gartner, Inc. and/or its affiliates. All rights reserved. Gartner is a registered trademark of Gartner, Inc. and its affiliates. This publication may not be reproduced or distributed in any form without Gartner’s prior written permission. It consists of the opinions of Gartner’s research organization, which should not be construed as statements of fact. While the information contained in this publication has been obtained from sources believed to be reliable, Gartner disclaims all warranties as to the accuracy, completeness or adequacy of such information. Although Gartner research may address legal and financial issues, Gartner does not provide legal or investment advice and its research should not be construed or used as such. Your access and use of this publication are governed by Gartner’s Usage Policy. Gartner prides itself on its reputation for independence and objectivity. Its research is produced independently by its research organization without input or influence from any third party. For further information, see Guiding Principles on Independence and Objectivity.

Already have a Gartner Account?

Purchase this Document

To purchase this document, you will need to register or sign in above

Become a client

Learn how to access this content as a Gartner client.