Master your role, transform your business and tap into an unsurpassed peer network through our world-leading virtual and in-person conferences.
Information Technology
Gartner Glossary
Through-Silicon Vias (TSVs)
Through-silicon vias (TSVs) involve the stacking of individual wafers (or individual dies) to form customized, multilayer, multifunctional devices. They are bonded together in the vertical direction using metalized holes or pillars as the primary interconnect method. Various types of wafers — such as radio frequency (RF), analog, digital and memory — can be bonded together using chemical and physical processes.
Related Content
Experience Gartner conferences
Gartner Webinars
Expert insights and strategies to address your priorities and solve your most pressing challenges.
