Through-Silicon Vias (TSVs)

Through-silicon vias (TSVs) involve the stacking of individual wafers (or individual dies) to form customized, multilayer, multifunctional devices. They are bonded together in the vertical direction using metalized holes or pillars as the primary interconnect method. Various types of wafers — such as radio frequency (RF), analog, digital and memory — can be bonded together using chemical and physical processes.