Information Technology

Gartner Glossary

Occam Process

The Occam Process is a solderless approach to electronics manufacturing. The process utilizes a reverse-order interconnection solution that employs mature, low-risk, familiar basic assembly technologies in a novel sequence. Components are interconnected by means of printing or plating after they are held into their final positions via an encapsulation process, thus eliminating conventional printed circuit boards (PCBs) and traditional solder.

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